- Attachment Method:
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- Material:
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- Package Cooled:
-
- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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2 Records
Image | Part | Manufacturer | Description | Price | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, BGA, 18 ... |
|
780
In-stock
|
Details Buy Now | |||
CUI Devices | HEATSINK TO-220 3.2W... |
0.000
|
35,000
In-stock
|
Details Buy Now |