- Attachment Method:
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- Package Cooled:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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5 Records
Image | Part | Manufacturer | Description | Price | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, STAMPI... |
|
1,944
In-stock
|
Details Buy Now | |||
CUI Devices | HEAT SINK, BGA, 25 ... |
|
1,433
In-stock
|
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CUI Devices | HEAT SINK, EXTRUS... |
|
605
In-stock
|
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CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | |||
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now |