- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Power Dissipation @ Temperature Rise：
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| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
|
3,205
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
|
510
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
|
376
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
|
502
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
|
319
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X9.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X7.5M... |
|
35,000
In-stock
|
Details Buy Now |
