- Manufacturer：
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- Cooling Source (1)
- CUI Devices (1)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Type：
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| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Cooling Source | 25X25 X20MM |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | 2 FINS, 2.00 OD HS W/... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | 2 FINS, 2.000 OD HS W... |
0.000
|
35,000
In-stock
|
Details Buy Now |
