- Manufacturer:
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- CUI Devices (2)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | Price | Stock | Action | |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
|
654
In-stock
|
Details Buy Now | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
|
668
In-stock
|
Details Buy Now | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
|
448
In-stock
|
Details Buy Now | |||
CUI Devices | HEAT SINK, STAMPI... |
|
2,870
In-stock
|
Details Buy Now | |||
CUI Devices | HEAT SINK, STAMPI... |
|
646
In-stock
|
Details Buy Now | |||
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X17.5M... |
|
35,000
In-stock
|
Details Buy Now |