- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | Price | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, STAMPI... |
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2,355
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Advanced Thermal Solutions, Inc. | HEATSINK TO-220 |
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Advanced Thermal Solutions, Inc. | HEATSINK TO-220 AL... |
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