- Manufacturer:
-
- CUI Devices (1)
- Attachment Method:
-
- Material:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
2 Records
Image | Part | Manufacturer | Description | Price | Stock | Action | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK TO-220 TO... |
|
6,335
In-stock
|
Details Buy Now | |||
CUI Devices | HEAT SINK, STAMPI... |
|
646
In-stock
|
Details Buy Now |