- Manufacturer：
-
- CTS Corporation (2)
- CUI Devices (1)
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
0.000
|
35,000
In-stock
|
Details Buy Now |
