- Manufacturer：
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- CUI Devices (1)
- Ohmite (1)
- Attachment Method：
-
- Material：
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- Package Cooled：
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- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
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- Type：
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6 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | BGA HEATSINK W/TA... |
|
167
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 21X21X23MM... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK HALF BR... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | 30.5MM LOW P HS ASS... |
0.000
|
35,000
In-stock
|
Details Buy Now |
