Manufacturer:
Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Image Part Manufacturer Description Price Stock Action
HSS02-B20-P318 CUI Devices
HEAT SINK, STAMPI...
$1.1700
RFQ
1,606
In-stock
Details Buy Now
906-31-1-18-2-B-0 Wakefield Thermal
HEAT SINK ELLIP F...
$7.2717
RFQ
35,000
In-stock
Details Buy Now
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